Liquid crystal display device

ABSTRACT

A liquid crystal display apparatus includes a conductive paste, which connects a connection pad in a TFT array substrate and a transparent conductive film in a color filter substrate, and a ridge which is disposed adjacent to a conductive paste in a surrounding region of the TFT array substrate. A sealing member located between the color filter substrate and the TFT array substrate convexly extends in a direction from a display region to a surrounding region to form the ridge.

TECHNICAL FIELD

The present invention relates to a liquid crystal display device whichhas a structure connecting a conductive film formed on a surface of acolor filter substrate of a liquid crystal display panel and anelectrode located on a side of a TFT array substrate using a conductiveresin, and can be preferably used in a liquid crystal display paneladopting an IPS mode or FFS mode, for example.

BACKGROUND ART

In a liquid crystal display device adopting the IPS mode or FFS mode,for example, a charge on a surface of a liquid crystal display panel(referred to as “the LCD panel” hereinafter) which reduces a displayquality needs to be transferred to a GND (ground) in accordance withcharacteristics of an electrode structure of driving a liquid crystal ofthe LCD panel. General as a method of transferring the charge is amethod of forming a transparent conductive film (an ITO film as anexample) on a surface of a color filter substrate (referred to as a CFsubstrate hereinafter) of the LCD panel, connecting the transparentconductive film to a GND electrode formed on a side of a TFT arraysubstrate of the LCD panel (referred to as the TFT substratehereinafter) using a conductive paste, and connecting the GND electrodeto a GND wiring of a flexible circuit substrate such as a flexibleprinted circuit (FPC) to transfer the charge to outside.

However, this connection method using the conductive paste has a problemthat a short circuit occurs between adjacent electrodes caused by theconductive paste diffusing and coming in contact with an adjacent otherelectrode or wiring, thereby causing a display defect, for example.

An insulating resin needs to be applied around the conductive paste toprotect the electrode and wiring, so that there is a problem that theinsulating resin comes in contact with the conductive paste, and asolvent contained in the insulating resin, for example, diffuses,thereby interfering with a connection reliability of the conductivepaste.

Well-known to solve those problems is a method of shaping a pattern ofan insulating film formed in a process of manufacturing the TFTsubstrate to provide a dam adjacent to the conductive paste, for example(Patent Document 1)

When a low-viscosity conductive paste which is easily diffused isapplied, adopted is a method of attaching a thin material such as a tapematerial, because of a film thinness thereof, in a form of a dam inadvance and removing the tape material after the conductive paste isapplied, for example (Patent Document 2).

Alternatively, there is also a method of applying an insulating resin toprovide a ridge in advance before applying the conductive paste (PatentDocument 3).

PRIOR ART DOCUMENTS Patent Documents

Patent Document 1: Japanese Patent Application Laid-Open No. 2010-122333

Patent Document 2: Japanese Patent Application Laid-Open No. 2008-299161

Patent Document 3: Japanese Patent Application Laid-Open No. 2012-242432

SUMMARY Problem to be Solved by the Invention

Herein, the dam described in Patent Document 1 is disposed by deformingthe pattern of the insulating film formed in the process ofmanufacturing the TFT substrate. However, as described in paragraph[0023] in Patent Document 1 and FIG. 4, the LCD panel includes a gap inan edge portion of a sealing member in a surrounding region of the TFTsubstrate, that is to say, between the CF substrate and the TFTsubstrate. Thus, particularly, when the low-viscosity conductive pasteor insulating resin is applied near the edge portion of the sealingmember, the conductive paste or the resin is transferred through agroove or the gap between the CF substrate and the TFT substrate bycapillary action and diffused peripherally.

In both Patent Documents 2 and 3, an additional processing is performedon a material to be the ridge after the CF substrate and the TFTsubstrate is attached to each other, that is to say, after the LCD panelis formed, so that a new material to be the ridge is necessary. Acomplex shape specific to the ridge further increases difficulty indesign and processing, so that a total number of manufacturing processesincreases and productivity decreases to achieve the ridge.

In Patent Document 3, the insulating resin itself which is applied inadvance to form the ridge is diffused, and an insulating film is formedon electrodes of the CF substrate and TFT substrate which are originallyelectrically connected to the conductive paste, thereby causing aconduction defect and interfering with the display quality.

The present invention has been made to solve the above-mentionedproblems and an object of the present invention is to form an effectiveridge which prevents a short circuit between electrodes on a TFTsubstrate occurring due to a diffusion of a conductive paste and alsoprevents a solvent, for example, contained in an insulating resin forprotecting surrounding electrodes from being diffused and coming incontact with the conductive paste, thus does not interfere with aconnection reliability of the conductive paste.

Means to Solve the Problem

A liquid crystal display device according to the present invention has afeature that it includes a first substrate having a first portion and asecond portion; a connection pad formed on the first portion of thefirst substrate; a second substrate facing the second portion of thefirst substrate; a liquid crystal held between the first substrate andthe second substrate; a sealing member being disposed between the firstsubstrate and the second substrate around the second portion to hold theliquid crystal; a conductive film formed on a surface of the secondsubstrate opposite to a surface facing the first substrate; a conductiveresin being provided to extend from an upper portion of the connectionpad to an upper portion of the conductive film to electrically connectthe connection pad and the conductive film; and a ridge disposedadjacent to the conductive resin in the first portion, and the sealingmember convexly extends in a direction from the second portion to thefirst portion to form the ridge.

Effects of the Invention

In an electrooptical display device according to the present invention,the ridge is molded in the process of applying the sealing member on theCF substrate or the TFT substrate, which is conventionally constructedas the process of manufacturing the LCD panel, using the same sealingmember, thus the additional material and number of manufacturingprocesses are not necessary.

Moreover, the sealing member, which is the adhesive material to attachthe CF substrate to the TFT substrate, also has the function ofpreventing the spread of the liquid crystal, thereby sufficiently havingthe function as the material of the ridge.

Furthermore, a fine and accurate application is conventionally requiredin applying the sealing member, and the application technique of moldingthe ridge having the complex shape can be sufficiently achieved by thesame specification of facility, thus the additional facility investmentis not required.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 A planar view illustrating a configuration of a liquid crystaldisplay device according to an embodiment 1 of the present invention.

FIG. 2 An enlarged planar view enlarging a broken line portion A in FIG.1.

FIG. 3 A cross sectional view taken along a broken line illustrated inFIG. 2.

FIG. 4 A side view seen from a B direction illustrated in FIG. 2 andFIG. 3.

FIG. 5 A planar view enlarging a part of a liquid crystal display deviceaccording to a modification example of the embodiment 1 of the presentinvention.

FIG. 6 A planar view enlarging a broken line portion A in a liquidcrystal display device according to an embodiment 2 of the presentinvention.

FIG. 7 A cross sectional view taken along a broken line IV-IVillustrated in FIG. 5.

FIG. 8 A side view seen from a C direction illustrated in FIG. 5 andFIG. 6.

FIG. 9 A planar view enlarging a part of a liquid crystal display deviceaccording to a first modification example of the embodiment 2 of thepresent invention.

FIG. 10 A cross sectional view taken along a broken line V-V illustratedin FIG. 9.

FIG. 11 A planar view enlarging a part of a liquid crystal displaydevice according to a second modification example of the embodiment 2 ofthe present invention.

DESCRIPTION OF EMBODIMENT(S)

Embodiments of the present invention is described with reference to thedrawings hereinafter. In order to prevent an overlapping and redundantdescription, the same reference numerals as those described in eachdrawing will be assigned to an element having the same or correspondingfunction.

Embodiment 1

The embodiment 1 of the present invention is described in detail withreference to the drawings hereinafter. FIG. 1 is a planar viewillustrating a whole configuration of a liquid crystal display deviceaccording to the embodiment 1. FIG. 2 is an enlarged planar viewenlarging a broken line portion A including a conductive paste 23 (aconductive resin) illustrated in FIG. 1. FIG. 3 is a cross sectionalview taken along a broken line illustrated in FIG. 2. FIG. 4 is a sideview seen from a B direction illustrated in FIG. 2 and FIG. 3.

<<Configuration>>

A configuration of a liquid crystal display device 100 according to thepresent embodiment 1 is firstly described using FIG. 1 and FIG. 2 whichis a partially enlarged view of FIG. 1. An LCD panel adopted to theliquid crystal display device 100 illustrated in FIG. 1 applies a FFSmode as a liquid crystal driving system, and a sealing member 19 isdisposed on a surrounding part of a display region between a CFsubstrate 11 (a first substrate) and a TFT substrate 12 (a secondsubstrate) to hold a liquid crystal 21. Furthermore, a CF sidepolarization plate 13 is provided on the CF substrate 11 and a TFT sidepolarization plate 14 is provided on the TFT substrate 12.

As is clear from FIG. 2 and FIG. 3, a transparent conductive film 15 (aconductive film) for eliminating electricity is formed to cover at leasta display region (a second portion) on a side of a display surface ofthe CF substrate 11 (between the CF substrate 11 and the CF polarizationplate 13, that is to say, on a surface of the CF substrate 11 oppositeto a surface facing the TFT substrate 12), and the transparentconductive film 15 extends to an end portion of the CF substrate 11 tobe easily connected to the GND.

A GND electrode 16 (a connection pad) is formed on a surface of the TFTsubstrate 12 (a surface on which the TFT array is formed) to beconnected to the transparent conductive film 15. A conductive paste 23(a conductive resin) is provided to connect the transparent conductivefilm 15 extending to the end portion of the CF substrate 11 and the GNDelectrode 16 formed on the TFT substrate 12.

Herein, as illustrated in the enlarged view FIG. 2, the sealing member19 holding the liquid crystal 21 has a ridge 20 convexly extending to aside of the surrounding region (a first portion) in addition to theportion of holding the liquid crystal 21 in the display region (thesecond portion). The ridge 20 of the sealing member 19 is disposed in aportion adjacent to the conductive paste 23 and prevents a diffusion ofthe conductive paste 23 until the conductive paste 23 is hardened.

Furthermore, as illustrated in FIG. 2 and FIG. 3, in the presentembodiment 1, a positional range of the ridge 20 is limited to the sameposition as an end of a cutting surface of the CF substrate 11 orslightly inside the end thereof, however, the ridge 20 can alsointerfere the diffusion of a protective resin 22 which protects theother electrode (not shown) on the surface of the TFT substrate 12. Asdescribed above, the ridge 20 is disposed in the predetermined position,thus the diffusion of the conductive paste 23 and the contact of theprotective resin 22 with the conductive paste 23 can be prevented.

A commonly used material such as glass, plastic and an insulating memberbeing a film-shaped resin is adopted to a base material of the CFsubstrate 11 and the TFT substrate 12, and a glass substrate is adoptedin the present embodiment. The transparent conductive film 15 and theGND electrode 16 illustrated in FIG. 2 are formed of a conductive membersuch as a metal film and a transparent conductive film (for example: ITOfilm) on the surfaces of the CF substrate 11 and TFT substrate 12 whichinclude the glass substrate as the base material. The sealing member 19and the ridge 20 molded by the sealing member 19 mainly includes aninsulating member such as epoxy as a base material. The protective resin22 for protecting the electrodes is also the insulating member.

<<Manufacturing Method>>

As described above, in the present embodiment, the sealing member 19which is an adhesive material is applied on the CF substrate 11 or theTFT substrate 12 to attach the CF substrate 11 to the TFT substrate 12and hold the liquid crystal 21, and the ridge 20 is molded using thesame material as the sealing member 19 at the same time. Processes ofmanufacturing the LCD panel is described in detail in sequencehereinafter.

Step 1: Process of Applying Sealing Member

Firstly, the sealing member 19 which is the adhesive material is appliedon the CF substrate 11 or the TFT substrate 12 to attach the CFsubstrate 11 to the TFT substrate 12 and hold the liquid crystal 21.Described is a case of applying the sealing member 19 on the TFTsubstrate 12 using a dispenser herein. The sealing member 19 is alsoapplied as the ridge 20 convexly extending to the side of thesurrounding region (the first portion) in addition to the portion ofsurrounding the display region (the second portion) to hold the liquidcrystal 21. A region where the ridge 20 is applied is estimated so thatan end of the ridge 20 (an extending direction) is molded in the sameposition as the end of the cutting surface of the CF substrate 11 orslightly inside the end thereof after a process of overlapping the TFTsubstrate 12 with the CF substrate 11 is completed in the subsequentstep. That is to say, the region where the ridge 20 is applied isappropriately determined with estimating a variation in application ofthe sealing member 19 and a variation in overlap between the CFsubstrate 11 and the TFT substrate 12. Furthermore, a connectionterminal on the TFT substrate 12 is disposed outside the cutting surfaceof the CF substrate 11, thus the ridge 20 does not reach the connectionterminal after the subsequent overlapping process.

Well-known as the method of applying the sealing member 19 is a methodusing a screen printing method as well as a method of using a dispenser,and also in this case, the ridge 20 can be formed by adding apredetermined region where the sealing member 19 is applied for theridge 20 to a screen plate in addition to the region where the sealingmember 19 is applied to hold the liquid crystal 21.

Step 2: Process of Overlapping and Sealing Liquid Crystal

Next, the process of overlapping the CF substrate 11 with the TFTsubstrate 12 and sealing the liquid crystal 21 is described. In thepresent embodiment, a predetermined amount of the liquid crystal 21 isdropped on one of the CF substrate 11 and the TFT substrate 12, andthen, the CF substrate 11 and the TFT substrate 12 are overlapped witheach other and the sealing member 19 is hardened to keep a predeterminedgap therebetween. Herein, since the sealing member 19 and the ridge 20are integrally molded, the ridge 20 which is tightly attached to the CFsubstrate 11 and the TFT substrate 12 without gap is generated. Asdescribed above, as a result of the overlapping, the forming region ofthe ridge 20 is located in the same position as the end of the cuttingsurface of the CF substrate 11 or slightly inside the end thereof.

A vacuum injection method is well known as the method of sealing theliquid crystal 21 as well as the falling-drop method adopted in thepresent embodiment, and the ridge 20 can be formed using the dispenseror the screen printing method in the manner similar to the falling-dropmethod described above except for providing an inlet from which theliquid crystal 21 is injected after applying the sealing member 19 andoverlapping the substrates.

Step 3: Process of Dividing LCD Panel

Generally required in manufacturing the LCD panel is the process ofdividing the LCD panel from a mother glass substrate and separating intoseveral pieces after the liquid crystal 21 is injected and then thesealing member 19 is hardened. The process of dividing the LCD panel toremove an unnecessary region around the LCD panel is necessary even whenthe LCD panel is large in size and only one piece of LCD panel can beobtained from the mother glass substrate. In the present embodiment, asa result of the overlapping described above, the forming region of theridge 20 is located in the same position as the end of the cuttingsurface of the CF substrate 11 or slightly inside the end thereof, thusthere is no particular need for consideration at the time of dividingthe CF substrate 11, and there is no difference from a normal process ofdividing the LCD panel.

Step 4: Process of Applying Conductive Paste

Next, the process of applying the conductive paste 23 is described. Asillustrated in FIG. 2 and FIG. 4, the conductive paste 23 is applied toconnect the transparent conductive film 15 extending to the end portionon the surface of the CF substrate 11 described above and the GNDelectrode 16 formed on the TFT substrate 12 described above using thedispenser.

Herein, as illustrated in FIG. 2, the ridge 20 is formed so that it doesnot reach the GND electrode 16 on the TFT substrate 12 in Step 2described above. Furthermore, as illustrated in the cross sectional viewin FIG. 3, there is the ridge 20 tightly attached to the CF substrate 11and the TFT substrate 12 without gap. Thus, as illustrated in FIG. 4,the conductive paste 23 is not transferred and diffused through a grooveor a gap 25 between the CF substrate 11 and the TFT substrate 12.

Step 5: Application of Insulating Resin

In the present embodiment, as illustrated in FIG. 2 and FIG. 4, theinsulating protective resin 22 is applied on a predetermined region inthe TFT substrate 12 to protect electrodes (not shown), a wiring 17, andmoreover a driver IC which is mounted in a form of COG after the driverIC and a FPC, for example, are mounted on the TFT substrate 12. That isto say, as illustrated in FIG. 2, the insulating protective resin 22needs to be applied over a relatively large range, and is applied on thepredetermined region manually or using the dispenser. Herein, since theridge 20 having a convex shape is formed between the region where theprotective resin 22 is applied and the region where the conductive paste23 is applied, the protective resin 22 is not diffused to come incontact with the conductive paste 23.

Modification Example of Embodiment 1

In the process of applying the sealing member according to theembodiment 1 described above, the sealing member 19 is applied so thatthe end of the ridge 20 is located in the same position as the end ofthe cutting surface of the CF substrate 11 or slightly inside the endthereof after the process of overlapping the TFT substrate 12 with theCF substrate 11 is completed in addition to the portion of surroundingthe display region to hold the liquid crystal 21. However, asillustrated in FIG. 5 which is the planar view enlarging a part of theliquid crystal display device according to the modification example ofthe embodiment 1 of the present invention (the broken line portion A),when the TFT substrate 12 and the CF substrate 11 can be divided fromeach other in the subsequent process of dividing the LCD panel, theridge 20 may protrude outside the cutting surface of the CF substrate11. In the above case, the excess diffusion of the protective resin 22can be prevented even when the conductive paste 23 and the protectiveresin 22 are applied more excessively.

Embodiment 2

The embodiment 2 of the present invention is described in detail withreference to the drawings hereinafter. FIG. 6 is an enlarged planar viewenlarging a surrounding part of the conductive paste 23 disposed in theliquid crystal display device 100 according to the embodiment 2 of thepresent invention. FIG. 7 is a cross sectional view taken along a brokenline IV-IV illustrated in FIG. 6. FIG. 8 is a side view seen from a Cdirection illustrated in FIG. 6 and FIG. 7.

<<Configuration>>

As illustrated in FIG. 6 and FIG. 8, in the LCD panel adopted to theliquid crystal display device 100 according to the present embodiment,the sealing member 19 holding the liquid crystal 21 has a ridge 220 anda ridge 221 in two points convexly extending to the side of thesurrounding region in addition to the portion to hold the liquid crystal21. The ridges 220 and 221 of the sealing member 19 are disposed tosandwich the conductive paste 23 and come in contact with both the rightand left sides thereof, and prevent the diffusion of the conductivepaste 23 until the conductive paste 23 is hardened. As is clear fromFIG. 7, the transparent conductive film 15 for eliminating electricityis formed to cover at least the display region on the surface of the CFsubstrate 11 (on the side of the display surface, between the CFsubstrate 11 and the CF polarization plate 13), and the transparentconductive film 15 extends to the end portion of the CF substrate 11 tobe easily connected to the GND.

The GND electrode 16 is formed on the surface of the TFT substrate 12(the surface on which the TFT array is formed) to be connected to thetransparent conductive film 15. Furthermore, the conductive paste 23 isprovided to connect the transparent conductive film 15 extending to theend portion of the CF substrate 11 and the GND electrode 16 formed onthe TFT substrate 12.

In the present embodiment, the liquid crystal driving system, theconfiguration of the CF substrate 11 (the first substrate) and the TFTsubstrate 12 (the second substrate), and the position where theconductive paste 23 is applied, for example, are similar to those in theembodiment 1 described above, thus the detailed description is omitted.

As illustrated in FIG. 6, in the present embodiment, the ridges 220 and221 having the convex shape are molded to be located on the both sidesof the conductive paste 23 using the same material as that of thesealing member 19. The ridges 220 and 221 interfere with the diffusionof the conductive paste 23 in the manner similar to the embodiment 1described above and also interfere with the protective resin 22 whichprotects the other electrodes (not shown) located in the both sides ofthe conductive paste 23 on the surface of the TFT substrate 12, therebypreventing a contact of the protective resin 22 with the conductivepaste 23.

Each end of the ridges 220 and 221 are molded in the same position asthe end of the cutting surface of the CF substrate 11 or slightly insidethe end thereof in the manner similar to the embodiment 1 describedabove, thus the CF substrate 11 can be easily divided subsequently.

<<Manufacturing Method>>

Steps 1 to 4

As described above, in the present embodiment, the sealing member 19holding the liquid crystal 21 has the ridge 220 and the ridge 221convexly extending to the side of the surrounding region in addition tothe portion to hold the liquid crystal 21. The ridges in the two pointscan be easily achieved by correcting an imaging range of the dispenserat the time of applying the sealing member 19 in Step 1 described in theembodiment 1. Alternatively, in the method using the screen printingmethod, the ridges can be easily achieved by correcting the screenplate. Since the other manufacturing method in Steps 1 to 4 is similarto that in the embodiment 1 described above, the detailed description isomitted.

In the meanwhile, as illustrated in FIG. 6 and FIG. 8, there are theridges 220 and 221 tightly attached to the CF substrate 11 and the TFTsubstrate 12 without gap. Thus, as illustrated in FIG. 8, the conductivepaste 23 is not transferred and diffused through the groove or the gap25 between the CF substrate 11 and the TFT substrate 12.

Step 4: Application of Insulating Resin

In the present embodiment, as illustrated in FIG. 6 and FIG. 8, theinsulating protective resin 22 is applied on the predetermined region inthe TFT substrate 12 to protect electrodes (not shown), the wiring 17,and moreover the driver IC which is mounted in the form of COG after thedriver IC and the FPC, for example, are mounted on the TFT substrate 12.That is to say, as illustrated in FIG. 6, the insulating protectiveresin 22 needs to be applied over a relatively large range on both theright and left sides of the conductive paste 23, and is applied on thepredetermined region manually or using the dispenser. Herein, since theridges 220 and 221 in the two points are formed between the region wherethe protective resin 22 is applied and the region where the conductivepaste 23 is applied, the protective resin 22 is not diffused to come incontact with the conductive paste 23.

First Modification Example of Embodiment 2

The first modification example of the embodiment 2 of the presentinvention is described in detail with reference to the drawingshereinafter. FIG. 9 is an enlarged planar view enlarging a surroundingpart of the conductive paste 23 disposed in the liquid crystal displaydevice 100 according to first modification example of the embodiment 2of the present invention. FIG. 10 is a cross sectional view taken alonga broken line V-V illustrated in FIG. 9.

In the present embodiment, the ridges 220 and 221 in the two pointsmolded by the sealing member 19 at the time of applying the sealingmember 19 in the liquid crystal display device of the embodiment 2described above are molded to protrude outside the cutting surface ofthe CF substrate 11 and disposed on the both sides of the conductivepaste 23. Furthermore, the transparent conductive film 15 formed on thesurface of the CF substrate 11 is connected to the GND electrode 16formed on the surface of the TFT substrate 12 via the conductive paste23.

Even when the conductive paste 23 is applied more excessively, theexcess diffusion of the conductive paste 23 can be prevented by reasonthat the ridges 220 and 221 further protrude outside the cutting surfaceof the CF substrate 11.

Furthermore, even when the protective resin 22 which protects the otherelectrodes (not shown) located in the both sides of the conductive paste23 on the surface of the TFT substrate 12 is applied more excessively,the excess diffusion of the protective resin 22 can be prevented byreason that the ridges 220 and 221 further protrude outside the cuttingsurface of the CF substrate 11. As a result, the contact of theprotective resin 22 with the conductive paste 23 can be prevented, thusthe effect similar to that in the second embodiment described above canbe obtained.

Second Modification Example of Embodiment 2

The second modification example of the embodiment 2 of the presentinvention is described in detail with reference to the drawingshereinafter. FIG. 11 is a planar view illustrating a configuration of aliquid crystal display device according to the second modificationexample of the embodiment 2 of the present invention.

In the present embodiment, in the process of applying the sealing member19 described in the embodiment 2 described above, the ridge 221 moldedby the sealing member 19 is formed to further extend outside the cuttingsurface of the CF substrate 11, and in the meanwhile, the ridge 220 ismolded in the same position as the end of the cutting surface of the CFsubstrate 11 or slightly inside the end thereof, as illustrated in FIG.11. The ridges 220 and 221 are molded to be disposed on the both sidesof the conductive paste 23. The transparent conductive film 15 formed onthe surface of the CF substrate 11 is connected to the GND electrode 16formed on the surface of the TFT substrate 12 via the conductive paste23. The ridge 220 and the ridge 221 effectively prevent the diffusion ofthe conductive paste 23 and the diffusion of the protective resin 22,thereby being able to prevent the contact of the protective resin 22with the conductive paste 23, thus the effect similar to that in theembodiment 1 and the second embodiment described above can be obtained.

In the second modification example of the present embodiment 2, the endof the ridge 220 is located in the same position as the end of thecutting surface of the CF substrate 11 or slightly inside the endthereof, thus the CF substrate 11 can be divided easily.

In the embodiments 1 and 2 described above, in the liquid crystaldisplay device adopting the IPS mode or the FFS mode, the transparentconductive film is formed on the surface of the CF substrate toeliminate the electricity, and the conductive paste is disposed toconnect the transparent conductive film to the GND. In the meanwhile, aliquid crystal display device integrated with a touch panel, in which acapacity detection type touch panel is disposed on a display surface ofa liquid crystal display device, becomes common recently. In the abovecase, there is a problem that a display driving signal in the liquidcrystal display device has an influence on a touch sensing signal in thetouch panel, thereby reducing a sensing sensitivity. As a measureagainst the problem described above, there is a case where a transparentconductive film is disposed on a surface of a CF substrate in an LCDpanel for a shielding. Also in the above case, the transparentconductive film needs to be connected to the GND, thus the embodiments 1to 3 of the present invention described above can be adopted. In theabove case, the liquid crystal mode of the liquid crystal display deviceis not limited to the IPS mode or the FFS mode, but it is obvious that aTN mode or a VA mode can also be adopted.

Furthermore, in the embodiments 1 and 2 described above, the inventionof the present application is described using the case of forming thetransparent conductive film such as ITO on the surface of the CFsubstrate in the LCD panel as the method of transferring the charge onthe surface of the LCD panel to the GND to eliminate the electricity,however, also adoptable is a configuration of providing a minute patternmade of a metal such as an aluminum alloy in a form of mesh on thesurface of the CF substrate, for example, to achieve both conductivityand high optical transparency.

EXPLANATION OF REFERENCE SIGNS

11 CF substrate, 12 TFT substrate, 13, 14 polarization plate, 15transparent conductive film, 16 GND electrode, 17 wiring, 19 sealingmember, 20, 220, 221 ridge, 21 liquid crystal, 22 protective resin, 23conductive paste, 100 liquid crystal display device.

The invention claimed is:
 1. A liquid crystal display device,comprising: a first substrate having a first portion and a secondportion; a connection pad formed on the first portion of the firstsubstrate; a second substrate facing the second portion of the firstsubstrate; a liquid crystal held between the first substrate and thesecond substrate; a sealing member being disposed between the firstsubstrate and the second substrate around the second portion to hold theliquid crystal; a conductive film formed on a surface of the secondsubstrate opposite to a surface facing the first substrate; and aconductive resin being provided to extend from an upper portion of theconnection pad to an upper portion of the conductive film toelectrically connect the connection pad and the conductive film, whereinthe sealing member has a ridge disposed adjacent to the conductive resinin the first portion, and the sealing member convexly extends in adirection from the second portion to the first portion to form theridge.
 2. The liquid crystal display device according to claim 1,wherein the ridge is disposed on both sides of the conductive resin. 3.The liquid crystal display device according to claim 2, wherein aninsulating resin for protecting a wiring is formed on the first portionon the first substrate, and the ridge is disposed between the conductiveresin and the insulating resin.
 4. The liquid crystal display deviceaccording to claim 2, wherein a tip portion of the ridge is located in aposition identical with an end of a cutting surface of the secondsubstrate or inside the end of the cutting surface of the secondsubstrate.
 5. The liquid crystal display device according to claim 1,wherein an insulating resin for protecting a wiring is formed on thefirst portion on the first substrate, and the ridge is disposed betweenthe conductive resin and the insulating resin.
 6. The liquid crystaldisplay device according to claim 5, wherein a tip portion of the ridgeis located in a position identical with an end of a cutting surface ofthe second substrate or inside the end of the cutting surface of thesecond substrate.
 7. The liquid crystal display device according toclaim 1, wherein a tip portion of the ridge is located in a positionidentical with an end of a cutting surface of the second substrate orinside the end of the cutting surface of the second substrate.
 8. Theliquid crystal display device according to claim 7, wherein a tipportion of the ridge is located in a position identical with an end of acutting surface of the second substrate or inside the end of the cuttingsurface of the second substrate.